3DIS TECHNOLOGIES SAS

Company information :
3DiS Technologies offers 3D integration and 3D packaging solutions based on its innovative 3D interconnection and 3D redistribution layer technologies. By leveraging the third dimension, the company’s cutting-edge technologies enable miniaturization of electronic systems and passive devices while improving their performance.

Our company proposes advanced electronic system packaging (System-in-Package) without using wirebonds, flip-chip or TSV. Our solutions are compatible with different substrate types (PCB glass, ceramics,...). We also offer substrate-less type of packaging for QFN-like and BGA (Fan-out WLP) and 3D wafer-level chip-scale packaging. Our solutions are tailored for RF systems (like 5G), IoT and sensors.

We provide also 3D integrated passive devices such as filters, baluns and couplers that offer excellent performance while being extremely small in size.